在线字典为您在线查询圆合的词典内容如下，包括圆合的拼音，读音，拼读；圆合的意思和详细释义，圆合的近反义词，圆合的英语翻译，用圆合这个词语怎么造句等内容。
圆合读音/繁体/五笔/英文翻译
| 拼音 | yuán hé | 读音 | 跟我读 |
|---|---|---|---|
| 繁体 | 圓合 | 类型 | 词语大全 |
| 五笔 | 此词无五笔连打 | 平音 | yuanhe |
| 词性 | 中性 | 语法 | |
| 拼读 | 元(yuan2)|喝(he1)鹅(e2)，合(he2) | ||
| 英语翻译 | 圆合成[计]Circle composition |
圆合是什么意思？
· 基本释义
衔接，吻合。
· 详细释义
衔接，吻合。
南朝 梁 刘勰 《文心雕龙·熔裁》：“然后舒华布实，献替节文，绳墨以外，美材既斲，故能首尾圆合，条贯统序。”
圆合的近反义词？
圆合近义词：抱歉，查无圆合的近义词
圆合反义词：抱歉，查无圆合的反义词
圆合词语接龙
（~圆合~）在开头的接龙：合同，合格，合唱，合法，合好，合上，合计，合并，合意，合页，合拍，合数，合理，合约，合伙，合成，合金，合影，合击，合照
（~圆合~）在结尾的接龙：综合，相合，联合，配合，适合，巧合，符合，汇合，缀合，集合，糅合，契合，融合，撮合，吻合，苟合，混合，结合，聚合，离合
暂时无法为您进行圆合的词语顺序接龙!
用圆合怎么造句？
您好，暂未查询到圆合造句的内容。
朱尤提周二表示，管理层还未作出最后决定，但不太可能削减今年计划的6.84万亿韩圆（合74亿美元）的预算。
Mr. Chu said yesterday that executives hadn't made a final decision but aren't likely to cut back from this year's planned spending of 6.84 trillion won ($7.4 billion).
本年度，本田 公司估计的运营利润为4,000亿日圆（约合45亿美元）。
The company's forecast for operating profit forecast is 400 billion yen, or roughly $4.5 billion, for the current year.
介绍了三种典型的圆片键合强度表现形式：抗拉强度、剪切强度和粘接强度。
Three typical manifestations of wafer bonding strength were introduced as tensile strength, shear strength and adhesive strength.
介绍了晶圆键合工艺、技术要求、应用选择以及对MEMS的作用；展示了MEMS制造技术和应用前景。
Introduces wafer bonding process, technical requirements, application choice and Interaction for MEMS, and showing MEMS fabrication technology and application prospects.
探讨了使用湿化学法对硅片表面进行活化，完成硅圆片低温直接键合的流程。
The process of low temperature wafer direct bonding using wet chemical surface activation methods are discussed.
基于一阶剪切变形理论和哈密顿原理，建立了旋转层合圆板动力学运动方程和相应的边界条件。
Based on the first order shear deformation theory and Hamiltonian principle, the governing equations and boundary conditions of rotating multi-layer annular plate were derived.
本文探讨了纤维增强复合材料正交对称铺设层合圆板的大挠度弯曲问题。
The large deflection problems of the symmetrically laminated cross-ply circular plates of fiber reinforced composites are investigated in this paper by using Galerkins procedure.
导体：一般采用相同或不同直径的圆单线绞合而成，本样本采用前者工艺。
Conductor: generally USES similar or not similar diameter twisted round single wire. This sample book adopts the former technology.
讨论了不同脱层深度和脱层半径对层合圆板的屈曲及后屈曲特性影响，且与有关文献的结果进行了比较。
The effects of delamination depth and radius on buckling and post-buckling of the laminated circular plates are discussed. Numerical results are compared with available data.
作为半导体制造领域的一项新兴的使能技术，晶圆直接键合已经在越来越多的领域发挥了重要的作用。
As one of the newly-emerged enabling technologies, wafer direct bonding has been playing key roles in more and more fields.
讨论了椭圆脱层形状、脱层深度、铺设材料等因素对脱层层合圆板屈曲及后屈曲性能的影响。
Then, the effects of elliptical delamination size, delamination depth and material properties on buckling and post-buckling of the laminated circular plates are discussed.
讨论了椭圆脱层形状、脱层深度、铺设材料等因素对脱层层合圆板屈曲及后屈曲性能的影响。
Then, the effects of elliptical delamination size, delamination depth and material properties on buckling and post-buckling of the laminated circular plates are discussed.
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